GUANGDONG SHENGYI SCI.TECH CO., LTD

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM8149
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 8108
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 597
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 276
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1124
 
  
 
C09J ADHESIVES; ADHESIVE PROCESSES IN GENERAL 154
 
  
 
D06M TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS 125
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173
 
  
 
H01Q AERIALS 1109

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9890276 Composite material, high-frequency circuit substrate made therefrom and making method thereofJul 14, 10Feb 13, 18[C08L, H05K]
9475970 Epoxy resin composition and copper clad laminate manufactured by using sameSep 02, 11Oct 25, 16[C09J, C08L, B32B, H05K]
9193858 Thermoset resin composition and its useMar 14, 13Nov 24, 15[C08L]
9076573 Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the sameSep 03, 11Jul 07, 15[C08J, H01B, C08K, B32B]
8883316 Composite material and high frequency substrate made therefromJan 27, 10Nov 11, 14[C08J, C08F, C08L, B32B, H05K, C08K]
8823599 Low-profile tunable wide-range loop-slot antennaAug 29, 10Sep 02, 14[H01Q]
8629219 Epoxy resin compound, preparation method thereof, prepreg made therefrom, and copper cladded laminate made therefromJun 22, 10Jan 14, 14[C08L, C08K, B32B]
8551628 Composite material, high-frequency circuit substrate made therefrom and making method thereofNov 07, 08Oct 08, 13[B32B]
8518527 Method for improving flame retardant efficiency of phenoxyphosphazene compound, and prepreg. laminate for printed circuit made by the methodAug 29, 10Aug 27, 13[C08L, B32B]
8445605 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefromAug 23, 10May 21, 13[C08L, B32B, C08K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0113,150 CYANATE ESTER RESIN COMPOSITION, AND A PREPREG, A LAMINATED MATERIAL AND A METAL CLAD LAMINATED MATERIAL MADE THEREFROMAbandonedMar 15, 13Apr 24, 14[C08L, C08K, B32B]
2014/0113,151 CYANATE ESTER RESIN COMPOSITION, AND A PREPREG, A LAMINATED MATERIAL AND A METAL CLAD LAMINATED MATERIAL MADE THEREFROMAbandonedMar 15, 13Apr 24, 14[C09D, B32B]
2014/0072,818 EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER CLAD LAMINATE MADE THEREFROMAbandonedMar 15, 13Mar 13, 14[H05K]
2013/0273,796 Halogen-Free High-Tg Resin Composition And Prepreg And Laminate Fabricated By Using The SameAbandonedSep 03, 11Oct 17, 13[C08L]
2013/0266,812 Epoxy Resin Composition, and Prepreg and Copper Clad Laminate Made TherefromAbandonedMar 15, 13Oct 10, 13[C08L, H05K]
2012/0164,463 CYANATE ESTER RESIN COMPOSITION, AND PREPREG AND LAMINATE MADE THEREFROMAbandonedDec 22, 11Jun 28, 12[B05D, C08G, C08L, B32B]
2012/0164,464 CYANATE ESTER RESIN COMPOSITION, AND PREPREG AND LAMINATE MADE THEREFROMAbandonedDec 22, 11Jun 28, 12[B05D, C08G, C08L, B32B]

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