GREDMANN TAIWAN LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 1204
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 183

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8456724 Biaxial scanning mirror for image forming apparatusExpiredJun 17, 10Jun 04, 13[G02B]
8453318 Method for making a planar coilExpiredOct 15, 12Jun 04, 13[H01F]
8318511 Integration manufacturing process for MEMS deviceExpiredJan 04, 12Nov 27, 12[H01L]
8310328 Planar coil and method of making the sameExpiredOct 07, 10Nov 13, 12[H01L, H01F]
8305671 Biaxial scanning mirror for image forming apparatus and method for operating the sameExpiredJun 21, 10Nov 06, 12[G02B]
8217329 Microminiaturized projection module having an image processing unit for transforming each of image signals into a modulating signal and a direction signal for projecting image onto objectExpiredJan 06, 10Jul 10, 12[H01L]
7598125 Method for wafer level packaging and fabricating cap structuresExpiredJun 26, 06Oct 06, 09[H01L]
7585417 Method of fabricating a diaphragm of a capacitive microphone deviceExpiredJun 23, 06Sep 08, 09[C23F]
7582511 Method for wafer level chip scale packaging with passive components integrated into packaging structureExpiredMay 17, 06Sep 01, 09[H01L]
7533564 Micro sample heating apparatus and method of making the sameExpiredMay 02, 06May 19, 09[G01F]
7505118 Wafer carrierExpiredOct 12, 04Mar 17, 09[H01L, G03B]
7395706 Micro sample heating apparatus and method of making the sameExpiredJun 23, 06Jul 08, 08[G01F]

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