GREDMAN TAIWAN LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 234
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 1204
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 183
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7987588 Interposer for connecting plurality of chips and method for manufacturing the sameNov 19, 08Aug 02, 11[H05K]
7361284 Method for wafer-level packageJun 23, 06Apr 22, 08[H01B]
7258806 Method of fabricating a diaphragm of a capacitive microphone deviceJun 23, 06Aug 21, 07[C23F]
7045463 Method of etching cavities having different aspect ratiosOct 28, 04May 16, 06[H01L]
7008821 Method of forming a wafer backside interconnecting wireNov 19, 04Mar 07, 06[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8456724 Biaxial scanning mirror for image forming apparatusExpiredJun 17, 10Jun 04, 13[G02B]
8453318 Method for making a planar coilExpiredOct 15, 12Jun 04, 13[H01F]
8310328 Planar coil and method of making the sameExpiredOct 07, 10Nov 13, 12[H01L, H01F]
8305671 Biaxial scanning mirror for image forming apparatus and method for operating the sameExpiredJun 21, 10Nov 06, 12[G02B]
7622334 Wafer-level packaging cutting method capable of protecting contact padsExpiredApr 09, 08Nov 24, 09[H01L]
7598125 Method for wafer level packaging and fabricating cap structuresExpiredJun 26, 06Oct 06, 09[H01L]
7585417 Method of fabricating a diaphragm of a capacitive microphone deviceExpiredJun 23, 06Sep 08, 09[C23F]
7582511 Method for wafer level chip scale packaging with passive components integrated into packaging structureExpiredMay 17, 06Sep 01, 09[H01L]
7533564 Micro sample heating apparatus and method of making the sameExpiredMay 02, 06May 19, 09[G01F]
7505118 Wafer carrierExpiredOct 12, 04Mar 17, 09[H01L, G03B]
7395706 Micro sample heating apparatus and method of making the sameExpiredJun 23, 06Jul 08, 08[G01F]

Top Inventors for This Owner

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