GLOBALFOUNDRIES U.S. 2 LLC COMPANY

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 11436
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2157
 
 
 
G11B INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER 2136
 
 
 
H04L TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION 2283
 
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 157
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
 
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
 
 
B44C PRODUCING DECORATIVE EFFECTS 133

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9847213 Vacuum trapMay 28, 15Dec 19, 17[H01J, C23C, F04F, C23F]
9772371 Voltage-driven intelligent characterization bench for semiconductorMar 17, 15Sep 26, 17[G06F, G01R]
9708508 Slurry for chemical-mechanical polishing of metals and use thereofJun 08, 15Jul 18, 17[C09K, H01L, C09G, C11D]
9671323 Detection of foreign material on a substrate chuckMay 06, 15Jun 06, 17[H01L, G01N]
9508578 Method and apparatus for detecting foreign material on a chuckFeb 04, 14Nov 29, 16[H01L, G01F]
9435828 Method of reconstructing electrical probesMay 23, 13Sep 06, 16[G01R]
9436789 Structure, method and system for complementary strain fill for integrated circuit chipsOct 17, 14Sep 06, 16[H01L, G06F]
9362230 Methods to form conductive thin film structuresMay 27, 15Jun 07, 16[H01L]
9348706 Maintaining a cluster of virtual machinesMar 31, 15May 24, 16[G06F]
9318375 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep viasAug 13, 09Apr 19, 16[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0189,743 PHOTO-PATTERNABLE DIELECTRIC MATERIALS AND FORMULATIONS AND METHODS OF USEAbandonedMar 11, 15Jul 02, 15[H05K]
2015/0102,428 MERGED FIN FINFET WITH (100) SIDEWALL SURFACES AND METHOD OF MAKING SAMEAbandonedOct 27, 14Apr 16, 15[H01L]
2015/0088,598 CROSS-RETAIL MARKETING BASED ON ANALYTICS OF MULTICHANNEL CLICKSTREAM DATAAbandonedSep 24, 13Mar 26, 15[G06Q]
2015/0062,340 High Occupancy Toll Lane ComplianceAbandonedSep 03, 13Mar 05, 15[H04N, G06K]
2015/0044,619 Carrier for Ultra-Thin Substrates and Method of UseAbandonedAug 07, 13Feb 12, 15[H01L, B65D]
2014/0337,111 REWARDING ONLINE ADVOCATESAbandonedMay 13, 13Nov 13, 14[G06Q]
2014/0262,039 METHOD OF FORMING ASYMMETRIC SPACERS AND METHODS OF FABRICATING SEMICONDUCTOR DEVICE USING ASYMMETRIC SPACERSAbandonedJun 03, 14Sep 18, 14[H01L]
2014/0110,888 STABILIZATION OF VINYL ETHER MATERIALSAbandonedDec 24, 13Apr 24, 14[B29C, G03F]
2013/0337,737 COMPRESSED GAS CYLINDER CABINET WITH REGULATED EXHAUST CONTROLAbandonedJun 14, 12Dec 19, 13[F24F]
2011/0068,462 SEMICONDUCTOR CHIP PACKAGES HAVING REDUCED STRESSAbandonedNov 24, 10Mar 24, 11[H01L]

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