FASFORD TECHNOLOGY CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 16346
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6151
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2123
 
  
 
B25J MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES 157
 
  
 
F04B POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS 161
 
  
 
G05B CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS 1100
 
  
 
H04Q SELECTING 1109

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9530751 Die bonder and bonding methodApr 29, 15Dec 27, 16[H01L, B23K]
9362250 Die bonder and bonding methodMar 04, 13Jun 07, 16[H01L, B29C]
9343338 Pick-up method of die bonder and die bonderSep 02, 11May 17, 16[H01L, B32B]
9324679 Two-shaft drive mechanism and die bonderAug 16, 12Apr 26, 16[H01L, B29C]
9318361 Collet cleaning method and die bonder using the sameDec 12, 13Apr 19, 16[H01L, F04B]
9245778 Die bonding apparatus, die picking up apparatus and die picking up methodFeb 28, 13Jan 26, 16[H01L, B32B]
9177937 Reaction absorber and semiconductor assembling systemSep 13, 10Nov 03, 15[H01L]
9099524 Die bonderSep 02, 11Aug 04, 15[H01L]
8991681 Die bonder and bonding methodMar 06, 12Mar 31, 15[H01L, B23K]
8965572 Frame feeding system and frame feeding methodSep 02, 11Feb 24, 15[H01L, B25J]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0265,094 DIE BONDER AND BONDING HEAD DEVICE OF THE SAME, AND ALSO COLLET POSITION ADJUSTING METHODAbandonedSep 12, 13Sep 18, 14[B23Q, B25B]
2014/0078,289 Die Bonder and Method of Position Recognition of DieAbandonedFeb 28, 13Mar 20, 14[H04N, G06T]
2014/0074,280 Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die BonderAbandonedMar 04, 13Mar 13, 14[G05B]
2013/0276,989 PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD, AND DIE BONDERAbandonedAug 16, 12Oct 24, 13[H01L]
2013/0068,826 Die Bonder and Bonding MethodAbandonedMar 09, 12Mar 21, 13[B23K]
2013/0014,881 Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating MethodAbandonedSep 06, 11Jan 17, 13[G05B, B32B]
2013/0014,904 Biaxial Drive Mechanism and Die BonderAbandonedSep 06, 11Jan 17, 13[B29C, B65G]

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