EV GROUP E. THALLNER GMBH

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 63299
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM12145
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 10115
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1094
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS792
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 596
 
  
 
B82Y SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE  OR TREATMENT OF NANO-STRUCTURES548
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
  
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 361
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 384

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0022,079 METHOD AND DEVICE FOR DETACHING A SUBSTRATE FROM A SUBSTRATE STACKJan 14, 15Jan 25, 18[C09J, H01L, B32B]
2017/0229,423 METHOD FOR PERMANENTLY BONDING WAFERSApr 27, 17Aug 10, 17[H01L]
2017/0162,538 METHOD FOR APPLYING A BONDING LAYERFeb 24, 17Jun 08, 17[H01L, B81C]
2017/0145,176 METHOD FOR APPLICATION OF A SILICON DIOXIDE LAYERJun 26, 14May 25, 17[C08J, D21H, B65D]
2017/0047,203 METHOD AND DEVICE FOR PLASMA TREATMENT OF SUBSTRATESMay 09, 14Feb 16, 17[H01J, H01L]
2016/0358,881 METHOD FOR BONDING SUBSTRATESDec 18, 14Dec 08, 16[H01L, B32B]
2016/0329,235 DEVICE AND METHOD FOR LOOSENING A FIRST SUBSTRATEJan 28, 14Nov 10, 16[H01L]
2016/0299,424 DIE WITH A DIE STRUCTURE AS WELL AS METHOD FOR ITS PRODUCTIONNov 29, 13Oct 13, 16[B41K, G03F]
2016/0240,420 DEVICE AND METHOD FOR ALIGNING SUBSTRATESDec 06, 13Aug 18, 16[H01L]
2016/0126,085 METHOD AND DEVICE FOR TREATING A SUBSTRATE SURFACEJul 04, 13May 05, 16[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922862 Device and method for loosening a first substrateJan 28, 14Mar 20, 18[H01L, B32B]
9911713 Method for applying a bonding layerFeb 24, 17Mar 06, 18[H01L, B81C]
9899223 Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substratesSep 25, 13Feb 20, 18[H01L]
9878334 Spray nozzle device and coating methodDec 11, 13Jan 30, 18[B05D, B05B]
9865492 Receiving device for handling structured substratesJan 07, 14Jan 09, 18[H01L, B23P, H05K]
9859246 Method for bonding substratesDec 18, 14Jan 02, 18[H01L, B32B]
9851645 Device and method for aligning substratesDec 06, 13Dec 26, 17[H01L, G01R, G03F]
9817216 Method and device for producing a plurality of microlensesMay 30, 12Nov 14, 17[B29C, B29D, G02B, B29L]
9806054 Flexible substrate holder, device and method for detaching a first substrateDec 22, 11Oct 31, 17[H01L, B32B]
9786487 Method for coating cavities of semiconductor substratesJan 09, 15Oct 10, 17[H01L, B08B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0047,784 METHOD FOR APPLYING A TEMPORARY BONDING LAYERAbandonedDec 16, 13Feb 19, 15[C23C, C25D, H01L]
2014/0360,666 METHOD AND DEVICE FOR BONDING OF SUBSTRATESAbandonedDec 28, 11Dec 11, 14[B32B]
2013/0288,454 METHOD FOR SEPARATING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATEAbandonedJan 17, 11Oct 31, 13[H01L]
2013/0270,756 RETAINING SYSTEM FOR RETAINING AND HOLDING A WAFERAbandonedDec 14, 10Oct 17, 13[H01L]

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