ESEC TRADING SA

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 291
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7146718 Apparatus for mounting semiconductorsMay 12, 04Dec 12, 06[H05K]
6460751 Bondhead for a wire bonderOct 24, 00Oct 08, 02[B23K]
6185815 Semiconductor mounting apparatus with a chip gripper travelling back and forthDec 02, 98Feb 13, 01[H05K]
5199630 Method and apparatus for measuring the vibration amplitude on an energy transducerJan 22, 92Apr 06, 93[B23K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7284318 Apparatus for mounting semiconductor chipsExpiredDec 05, 02Oct 23, 07[B23P]
7159751 Wire bonderExpiredMay 25, 04Jan 09, 07[B23K]
7120995 Apparatus for mounting semiconductorsExpiredJun 03, 04Oct 17, 06[B23P]
7108167 Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and methodExpiredApr 07, 04Sep 19, 06[B23K]
7080771 Method for checking the quality of a wedge bondExpiredJun 08, 04Jul 25, 06[B23K]
7020954 Apparatus for placing a semiconductor chip as a flipchip on a substrateExpiredFeb 28, 02Apr 04, 06[B29P]
7004372 Method for determining optimum bond parameters when bonding with a wire bonderExpiredOct 16, 03Feb 28, 06[B23K]
6993986 Clamping element with an integrated force sensorExpiredJun 24, 03Feb 07, 06[F16B]
6935539 Device for the metered delivery of a viscous liquidExpiredNov 26, 03Aug 30, 05[G01F]
6931932 Device for measuring the amplitude of the tip of an oscillating capillaryExpiredDec 19, 03Aug 23, 05[B23K, G01N]
6929168 Method for determining optimum bonding parameters for bonding with a wire bonderExpiredFeb 03, 03Aug 16, 05[B23K]
6898481 Apparatus for mounting semiconductor chipsExpiredMar 13, 03May 24, 05[G06F]
6857554 Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonderExpiredMar 18, 03Feb 22, 05[B23K]
2005/0029,328 Method for checking the quality of a wedge bondAbandonedJun 02, 04Feb 10, 05[B23K]
6839958 Apparatus for mounting semiconductor chipsExpiredSep 12, 01Jan 11, 05[H05K]
6820793 Apparatus for the transport and equipping of substrates with semiconductor chipsExpiredJul 29, 02Nov 23, 04[B23K]
6821375 Method and apparatus for mounting semiconductor chips onto a flexible substrateExpiredJul 02, 01Nov 23, 04[B29C]
6811074 Method and apparatus for dispensing solder on a substrateExpiredFeb 27, 03Nov 02, 04[B23K]
2004/0182,912 Wire bonderAbandonedMar 17, 04Sep 23, 04[B23K]
2004/0170,524 Unleaded solderAbandonedDec 12, 03Sep 02, 04[C22C]

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