ELECTROPLATING ENGINEERS OF JAPAN LIMITED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1536
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 893
 
  
 
C25B ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR 332
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
C25C PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR 217
 
  
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 163
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 151
 
  
 
C22C ALLOYS 171

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8771409 Electroless gold plating solution and electroless gold plating methodApr 15, 11Jul 08, 14[C23C]
7887692 Palladium plating solutionFeb 27, 07Feb 15, 11[C23C, C25D]
7799186 Plating apparatusMay 24, 06Sep 21, 10[C25D]
7179359 Cup-shaped plating apparatusOct 11, 02Feb 20, 07[C25D]
6875333 Plating apparatus for waferFeb 13, 03Apr 05, 05[C25D]
6767392 Displacement gold plating solutionMay 24, 02Jul 27, 04[C23C, B05D, B05B, B22F]
6482300 Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereofFeb 09, 01Nov 19, 02[C25D, C25C, C25B]
6454918 Cup type plating apparatusMar 01, 00Sep 24, 02[C25D, C25C, C25B]
6332963 Cup-type plating apparatus and method for plating wafer using the sameSep 24, 99Dec 25, 01[C25B]
5935330 Automatic wafer plating equipmentJul 28, 97Aug 10, 99[B05C]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0137,356 NON-CYANIDE ELECTROLYTIC GOLD PLATING SOLUTIONAbandonedSep 19, 13May 21, 15[C25D, H01L]
2012/0171,367 DISPLACEMENT GOLD PLATING SOLUTION AND METHOD FOR FORMING CONNECTING PORTIONAbandonedApr 15, 11Jul 05, 12[B05D, C09D]
2012/0073,980 IRIDIUM PLATING SOLUTION AND METHOD OF PLATING USING THE SAMEAbandonedSep 29, 10Mar 29, 12[C25D]
2011/0127,168 HARD GOLD-BASED PLATING SOLUTIONAbandonedAug 06, 09Jun 02, 11[C25D]
2010/0038,252 METHOD OF PLATING A WAFERAbandonedAug 12, 08Feb 18, 10[C25D]
2007/0289,873 Method of wafer platingAbandonedJun 01, 07Dec 20, 07[C25D]
7108776 Plating apparatus and plating methodExpiredOct 08, 02Sep 19, 06[C25D]
6991711 Cup type plating apparatusExpiredMar 05, 02Jan 31, 06[C25D]
6736945 Wafer plating apparatusExpiredFeb 26, 01May 18, 04[C25D]
6610182 Cup-type plating apparatus and method for plating wafersExpiredJun 18, 01Aug 26, 03[C25D]
2003/0085,133 Copper plating solution for embedding fine wiring, and copper plating method using the sameAbandonedApr 25, 02May 08, 03[C25D]
6511589 Gold plating solution and gold plating method using thereofExpiredAug 17, 01Jan 28, 03[C23C, C25D]
2001/0017,105 Wafer plating apparatusAbandonedFeb 26, 01Aug 30, 01[B05C]
6224670 Cup-type plating method and cleaning apparatus used thereforExpiredDec 03, 98May 01, 01[B05C]
5807469 Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnectsExpiredSep 27, 95Sep 15, 98[C25D]
5475918 Method of preventing deformation of lead framesExpiredSep 16, 94Dec 19, 95[C25D, H01L]
4904311 Metallic powder and a paste made from it, and a metallic powder manufacture deviceExpiredDec 29, 88Feb 27, 90[B23K]
4880511 Process and apparatus for recovery of precious metal compoundExpiredMay 16, 87Nov 14, 89[C02F, B01D]
4851902 Auatomatic inspection system for IC lead frames and visual inspection method thereofExpiredAug 05, 87Jul 25, 89[H04N]
4702811 Plating device for minute portions of connector terminalsExpiredOct 29, 86Oct 27, 87[C25D]

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