EBARA-UDYLITE CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 299
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 249
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8354014 Palladium complex and catalyst-imparting treatment solution using the sameNov 02, 06Jan 15, 13[C23C, C25D]
6800188 Copper plating bath and plating method for substrate using the copper plating bathMay 09, 02Oct 05, 04[C23C, C25D]
6518182 Via-filling processNov 13, 00Feb 11, 03[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0064,954 METHOD FOR CONDITIONING INSULATING RESIN AND ITS USEAbandonedMay 22, 08Mar 17, 11[C08G, B05D, C08F, B32B]
2009/0277,798 CATALYST ATTACHMENT-ENHANCING AGENTAbandonedAug 28, 06Nov 12, 09[C25D, C08G]
2009/0176,022 SURFACE MODIFICATION LIQUID FOR PLASTIC AND METHOD OF METALLIZING PLASTIC SURFACE THEREWITHAbandonedMar 31, 06Jul 09, 09[C09K, C25D, B05D]
2008/0264,798 Copper Plating Bath and Plating MethodAbandonedJun 13, 08Oct 30, 08[C25D]
2008/0087,549 Additive For Copper Plating And Process For Producing Electronic Circiut Substrate TherewithAbandonedAug 18, 04Apr 17, 08[C25D, C07D]
2005/0282,384 Method for forming protective film and electroless plating bathAbandonedJun 17, 04Dec 22, 05[H01L]
2005/0126,919 Plating method, plating apparatus and a method of forming fine circuit wiringAbandonedNov 04, 04Jun 16, 05[C25D]
2005/0072,683 Copper plating bath and plating methodAbandonedApr 02, 04Apr 07, 05[C25D]
2005/0045,486 Plating method and plating solutionAbandonedJul 07, 04Mar 03, 05[C25D, H01L]
6458264 Sn-Cu alloy plating bathExpiredOct 05, 00Oct 01, 02[C25D]
6329072 Microporous copper film and electroless copper plating solution for obtaining the sameExpiredAug 23, 99Dec 11, 01[C23C, B05D]
6193789 Electroless copper plating solution and method for electroless copper platingExpiredDec 01, 98Feb 27, 01[C23C]
5441619 Electroplating apparatusExpiredDec 06, 93Aug 15, 95[C25D]
5248406 Electroplating bath solution for zinc alloy and electroplated product using the sameExpiredMar 06, 91Sep 28, 93[C25D]
4699696 Zinc-nickel alloy electrolyte and processExpiredApr 15, 86Oct 13, 87[C25D]
4591416 Chromate composition and process for treating zinc-nickel alloysExpiredJan 04, 83May 27, 86[C23C, C25D]

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