Commissariat à l'Energie Atomique (CEA)

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 7355

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7776716 Method for fabricating a semiconductor on insulator waferMay 09, 07Aug 17, 10[H01L]
7235461 Method for bonding semiconductor structures togetherApr 27, 04Jun 26, 07[H01L]
7189632 Multifunctional metallic bondingDec 22, 03Mar 13, 07[H01L]
7060590 Layer transfer methodJan 06, 04Jun 13, 06[H01L]
7008859 Wafer and method of producing a substrate by transfer of a layer that includes foreign speciesOct 06, 03Mar 07, 06[H01L]
6991944 Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materialsAug 10, 04Jan 31, 06[H01L]
6913971 Layer transfer methodsJul 09, 03Jul 05, 05[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7115481 Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrateExpiredOct 14, 03Oct 03, 06[H01L]
2005/0130,393 Method for improving the quality of heterostructureAbandonedMay 05, 04Jun 16, 05[H01L, C30B]

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