Carsem (M) Sdn. Bhd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 9353
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9048397 Color yield of white LEDsJan 06, 14Jun 02, 15[H01L]
8946913 Short and low loop wire bondingAug 12, 13Feb 03, 15[H01L]
8941249 Low loop wire bondingJul 16, 13Jan 27, 15[H01L, B23K]
8674488 Light emitting diode (LED) packagesFeb 13, 13Mar 18, 14[H01L, H01R]
8535988 Large panel leadframeMay 25, 12Sep 17, 13[H01L]
8525352 Short and low loop wire bondingSep 08, 11Sep 03, 13[H01L]
7786554 Stress-free lead frameOct 05, 07Aug 31, 10[H01L]
7741161 Method of making integrated circuit package with transparent encapsulantJun 30, 08Jun 22, 10[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0021,491 MULTI-COMPOUND MOLDINGAbandonedJan 28, 13Jan 23, 14[H01L]
8394675 Manufacturing light emitting diode (LED) packagesExpiredMay 26, 11Mar 12, 13[H01L]
2012/0043,655 WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDERAbandonedNov 01, 11Feb 23, 12[H01L]

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