CREE FAYETTEVILLE, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 13143
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
  
 
H04Q SELECTING 4106
 
  
 
H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 399
 
  
 
H03F AMPLIFIERS 380
 
  
 
H03K PULSE TECHNIQUE 3128
 
  
 
F02C GAS-TURBINE PLANTS; AIR INTAKES FOR JET-PROPULSION PLANTS; CONTROLLING FUEL SUPPLY IN AIR-BREATHING JET-PROPULSION PLANTS 257
 
  
 
G01K MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR 244
 
  
 
G05F SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES 298
 
  
 
G08C TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS 253

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9839146 High voltage power moduleOct 20, 15Dec 05, 17[H01L, H02M, H05K]
9761506 Semiconductor device and fabrication method for the sameFeb 23, 12Sep 12, 17[H01L]
9728868 Apparatus having self healing liquid phase power connects and method thereofFeb 10, 14Aug 08, 17[H01R, H05K]
9647563 Active energy recovery clamping circuit to improve the performance of power convertersFeb 27, 15May 09, 17[H02M]
9615452 Silver filled trench substrate for high power and/or high temperature electronicsMay 10, 13Apr 04, 17[H05K]
9559684 Non linear resonant switch cellJun 19, 14Jan 31, 17[H03K]
9435819 Autonomous temperature accelerometer sensorApr 29, 13Sep 06, 16[G01H, G01M, G01P]
9426883 Low profile, highly configurable, current sharing paralleled wide band gap power device power moduleJan 30, 15Aug 23, 16[H01L, H05K]
9419448 Multi-module, scalable, high power density, radiation-hardened power converter interface systemJun 18, 14Aug 16, 16[H02J]
9407251 Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integrationDec 09, 13Aug 02, 16[H03K, H05K]

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Expired/Abandoned/Withdrawn Patents

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Top Inventors for This Owner

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