COMPONENT RE-ENGINEERING COMPANY, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 687
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM4153
 
  
 
C04B LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS 365
 
  
 
F16B DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING 346
 
  
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 3108
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9624137 Low temperature method for hermetically joining non-diffusing ceramic materialsMay 30, 14Apr 18, 17[H01L, C04B, B23K, F16B, B32B]
9556074 Method for manufacture of a multi-layer plate deviceNov 20, 12Jan 31, 17[C04B, H05B, B23K, F16B, B32B]
9315424 Multi-layer plate deviceNov 20, 12Apr 19, 16[H05B, C04B, B23K, F16B, B32B]
8932690 Plate and shaft deviceJul 06, 12Jan 13, 15[B32B]
8789743 Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsNov 20, 12Jul 29, 14[B23K]
8684256 Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processingNov 20, 12Apr 01, 14[B23K]
7098428 System and method for an improved susceptorJan 26, 05Aug 29, 06[H05B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0250,471 COMPRESSIBLE CONDUCTIVE ELEMENT FOR USE IN CURRENT-CARRYING STRUCTUREAbandonedMar 12, 13Sep 26, 13[H01L]
2013/0189,022 Hermetically Joined Plate And Shaft DevicesAbandonedNov 20, 12Jul 25, 13[F16B]
2010/0177,454 Electrostatic chuck with dielectric insertsAbandonedJan 09, 09Jul 15, 10[H01L, H01B]
2008/0314,320 Chamber Mount for High Temperature Application of AIN HeatersAbandonedMay 05, 08Dec 25, 08[C23C, H01L]
2007/0169,703 Advanced ceramic heater for substrate processingAbandonedAug 24, 06Jul 26, 07[C23C, H01L]

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