COMPEQ MANUFACTURING COMPANY LIMITED
Patent Owner
Stats
- 5 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Oct 11, 2011 most recent publication
Details
- 5 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 212 Total Citation Count
- May 07, 1990 Earliest Filing
- 25 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
8033013 Method of making rigid-flexible printed circuit board having a peelable maskJun 30, 08Oct 11, 11[H05K]
6639396 Detecting structure formed on a PCB to detect unavailability of the linesSep 26, 01Oct 28, 03[G01R]
6278356 Flat, built-in resistors and capacitors for a printed circuit boardMay 17, 00Aug 21, 01[H01L]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2007/0227,762 Multilayer circuit board with grounding grids and method for controlling characteristic impedance of the multilayer circuit boardAbandonedApr 04, 06Oct 04, 07[H05K]
2006/0099,790 Method of implanting at least one solder bump on a printed circuit boardAbandonedOct 26, 04May 11, 06[H01L]
6979636 Method for forming heightened solder bumps on circuit boardsExpiredFeb 09, 05Dec 27, 05[H01L]
6753746 Printed circuit board having jumper lines and the method for making said printed circuit boardExpiredNov 07, 01Jun 22, 04[H01P]
6675704 Solder paste stenciling apparatus for minimizing residue of solder pasteExpiredMar 06, 02Jan 13, 04[B41F]
2003/0194,655 Method for fabricating resistors on a printed circuit boardAbandonedApr 10, 02Oct 16, 03[G03F]
2003/0194,845 Method for fabricting a resistor on a printed circuit boardAbandonedApr 10, 02Oct 16, 03[H01L]
2003/0178,466 Solder paste stenciling apparatus for minimizing residue of solder pasteAbandonedMar 20, 02Sep 25, 03[B23K]
2003/0106,630 Pin lamination method that may eliminate pits and dents formed in a multi-layer printed wiring board and the ply-up device thereofAbandonedDec 10, 01Jun 12, 03[B32B]
2003/0080,826 Method of shortening a microwave circuit and the printed circuit board made by using said methodAbandonedOct 30, 01May 01, 03[H01P]
2003/0029,832 Method for forming large integration and ultra-fine lines on a substrateAbandonedAug 13, 01Feb 13, 03[H01L]
2002/0002,771 Method for making a planar inductor/transformer in a laminated printed circuit boardAbandonedAug 29, 01Jan 10, 02[H01F, H05K]
6295631 Method for determining the compensation value of the width of a wire by measuring the resistance of the wireExpiredSep 13, 99Sep 25, 01[G06F]
6057179 Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating regionExpiredMar 17, 98May 02, 00[H01L]
5884396 Transfer flat type ball grid array method for manufacturing packaging substrateExpiredMay 01, 97Mar 23, 99[H01R]
5882957 Ball grid array packaging method for an integrated circuit and structure realized by the methodExpiredJun 09, 97Mar 16, 99[H01L]
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