CMK CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 9353
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8035979 Printed wiring board with built-in semiconductor element, and process for producing the sameDec 13, 10Oct 11, 11[H05K]
7910405 Semiconductor device having adhesion increasing film to prevent peelingJun 12, 07Mar 22, 11[H01L]
7894200 Printed wiring board with built-in semiconductor element, and process for producing the sameNov 28, 06Feb 22, 11[H05K]
7867828 Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried thereinJul 24, 07Jan 11, 11[H01L]
7709942 Semiconductor package, including connected upper and lower interconnectionsJun 02, 04May 04, 10[H01L]
7615411 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereofMar 12, 08Nov 10, 09[H01L]
7608480 Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portionJul 20, 07Oct 27, 09[H01L]
7445964 Semiconductor device and method of manufacturing the sameDec 13, 06Nov 04, 08[H01L]
7363706 Method of manufacturing a multilayer printed wiring boardAug 25, 05Apr 29, 08[H01K]
7297878 High frequency laminated component and its manufacturing methodDec 22, 03Nov 20, 07[H01R]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7489032 Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the sameExpiredDec 20, 04Feb 10, 09[H01L]
7256496 Semiconductor device having adhesion increasing film to prevent peelingExpiredJun 01, 05Aug 14, 07[H01L]
7243425 Printed wiring board and method of manufacturing the sameExpiredAug 25, 05Jul 17, 07[H01K]
2007/0074,902 Printed-wiring board, multilayer printed-wiring board and manufacturing process thereforAbandonedJun 14, 06Apr 05, 07[H01K, H05K]
5633480 Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuitsExpiredOct 04, 95May 27, 97[H05K]
5377406 Process for producing a printed circuit boardExpiredNov 29, 93Jan 03, 95[H05K]

Top Inventors for This Owner

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