CIT LENDING SERVICES CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 390
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
A61B DIAGNOSIS; SURGERY; IDENTIFICATION 1239
 
  
 
B65D CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES 197
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1119
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1446
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7041771 Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow solderingMay 28, 96May 09, 06[C08G]
6862635 Synchronization techniques in a multithreaded environmentJul 27, 99Mar 01, 05[G06F]
6835177 Ultrasonic blood vessel measurement apparatus and methodOct 09, 03Dec 28, 04[A61B, G06K]
6819004 Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow solderingFeb 10, 03Nov 16, 04[H01L]
6786391 Method of controlling solder deposition utilizing two fluxes and preformOct 16, 02Sep 07, 04[B23K]
6615484 Method of manufacturing an electrical connection using solder flux compatible with flip chip underfill materialJan 18, 02Sep 09, 03[H05K]
6367150 Solder flux compatible with flip-chip underfill materialSep 04, 98Apr 09, 02[H05K]
5334260 No-clean, low-residue, volatile organic compound free soldering flux and method of useFeb 05, 93Aug 02, 94[B23K]
5281281 No-clean, low-residue, volatile organic compound free soldering flux and method of useFeb 05, 93Jan 25, 94[B23K]
5064066 Package for spooled productsMar 25, 91Nov 12, 91[B65D]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8133433 Bismuth-indium amalgam, fluorescent lamps, and methods of manufactureExpiredSep 26, 06Mar 13, 12[H01J, C22C]
2006/0226,783 Krypton metal halide lampsAbandonedJul 13, 05Oct 12, 06[H01J]
2006/0169,187 Height adjustable lazy susan shelfAbandonedJan 28, 05Aug 03, 06[A47B]
2005/0100,746 Optical coatings and methodsAbandonedNov 05, 04May 12, 05[B32B]
2005/0094,940 Integrated light source and optical waveguide and methodAbandonedSep 27, 04May 05, 05[G02B]
2005/0077,301 Rotationally molded subterranean tank with riserAbandonedDec 03, 04Apr 14, 05[E02D]
2005/0023,328 Method of controlling solder deposition utilizing two fluxes and preformAbandonedSep 03, 04Feb 03, 05[B23K]
2004/0188,447 Underground storage tankAbandonedApr 12, 04Sep 30, 04[B65D]
2003/0009,418 Systems and methods for electronically verifying and processing informationAbandonedDec 05, 01Jan 09, 03[G06F]
5715745 Humidified and heated cabinet for storing foodExpiredApr 11, 97Feb 10, 98[A23L, A21B]

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