CABOT MICROELECTRONICS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 1218
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 110254
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR9335
 
  
 
C09G POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES752
 
  
 
B24D TOOLS FOR GRINDING, BUFFING, OR SHARPENING 5010
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 2415
 
  
 
C03C CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS2139
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 1618
 
  
 
C09C TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES 1119
 
  
 
C11D DETERGENT COMPOSITIONS 560

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0072,916 DIAMOND-BASED SLURRIES WITH IMPROVED SAPPHIRE REMOVAL RATE AND SURFACE ROUGHNESSApr 13, 16Mar 15, 18[C09K, H01L, C09G]
2017/0348,820 CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACEJun 06, 17Dec 07, 17[B24B, C09K]
2017/0260,421 COBALT POLISHING ACCELERATORSMay 24, 17Sep 14, 17[B24B, H01L, C09G, C23F]
2017/0158,993 STABILIZATION OF TRIS(2 HYDROXYETHYL)METHYLAMMONIUM HYDROXIDE AGAINST DECOMPOSITION WITH DIALKYHYDROXYLAMINEJul 17, 15Jun 08, 17[H01L, C11D]
2017/0120,417 POLISHING PAD WITH FOUNDATION LAYER AND WINDOW ATTACHED THERETONov 03, 15May 04, 17[B24B]
2017/0066,944 METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATEAug 31, 16Mar 09, 17[H01L, C09G]
2016/0221,145 LOW DENSITY POLISHING PADJan 30, 15Aug 04, 16[B24B, C08J]
2016/0060,487 COMPOSITION AND METHOD FOR POLISHING A SAPPHIRE SURFACEAug 28, 15Mar 03, 16[C09G]
2016/0023,322 POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERNOct 05, 15Jan 28, 16[B24B, B24D]
2015/0343,595 SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATEAug 11, 15Dec 03, 15[B24B, C08G, B24D]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9909032 Composition and method for polishing memory hard disksJan 15, 14Mar 06, 18[B24B, C09K, H01L, C09G, C09C, G11B]
9868185 Polishing pad with foundation layer and window attached theretoNov 03, 15Jan 16, 18[B24B]
9850402 CMP compositions and methods for selective removal of silicon nitrideDec 09, 13Dec 26, 17[C09K, H01L, C09G]
9850403 Cobalt polishing acceleratorsMay 24, 17Dec 26, 17[B24B, H01L, C09G, C23F]
9834704 Cobalt dishing control agentsOct 21, 15Dec 05, 17[B24B, H01L, C09G]
9828528 Polishing composition containing ceria abrasiveOct 31, 16Nov 28, 17[B24B, C09K, H01L, C09G]
9828574 Cleaning composition and method for cleaning semiconductor wafers after CMPJan 12, 16Nov 28, 17[H01L, C11D]
9818618 Multi-layer polishing pad for CMPApr 30, 15Nov 14, 17[B24B, H01L, B24D]
9803106 Methods for fabricating a chemical-mechanical polishing compositionJun 25, 15Oct 31, 17[B24B, C09K, H01L, C09G]
9803109 CMP composition for silicon nitride removalFeb 03, 15Oct 31, 17[C09K, H01L, C03C, C09G, C09D, B44C, C25F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0144,477 COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHINGAbandonedMar 02, 15May 26, 16[B24B, B24D]
2016/0053,381 GERMANIUM CHEMICAL MECHANICAL POLISHINGAbandonedAug 22, 14Feb 25, 16[C23F]
2014/0370,788 LOW SURFACE ROUGHNESS POLISHING PADAbandonedJun 13, 13Dec 18, 14[B24B]
2014/0264,151 AQUEOUS CLEANING COMPOSITION FOR POST COPPER CHEMICAL MECHANICAL PLANARIZATIONAbandonedMar 13, 14Sep 18, 14[C09K]
2014/0054,266 COMPOSITIONS AND METHODS FOR SELECTIVE POLISHING OF PLATINUM AND RUTHENIUM MATERIALSAbandonedAug 24, 12Feb 27, 14[C09K, C23F]
8636560 Wiresaw apparatus and method for continuous removal of magnetic impurties during wiresaw cuttingExpiredDec 21, 09Jan 28, 14[B28D]
2013/0327,977 COMPOSITION AND METHOD FOR POLISHING MOLYBDENUMAbandonedJun 10, 13Dec 12, 13[H01L, C09G]
2013/0237,136 POLISHING PAD COMPRISING TRANSMISSIVE REGIONAbandonedNov 18, 11Sep 12, 13[B24B, B24D]
8460507 CMP sensor and control systemExpiredSep 03, 08Jun 11, 13[B24B, C23F]
8425639 Wire saw slurry recycling processExpiredJun 01, 09Apr 23, 13[C09K, C09C, B24D]
2012/0042,575 CMP SLURRY RECYCLING SYSTEM AND METHODSAbandonedAug 16, 11Feb 23, 12[C09K, C09G, B01D]
2011/0247,996 DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANTAbandonedJun 23, 11Oct 13, 11[B24B, C09G, C23F]
2011/0240,002 CUTTING FLUID COMPOSITION FOR WIRESAWINGAbandonedDec 21, 09Oct 06, 11[C09K, H01L, B28D]
7998335 Controlled electrochemical polishing methodExpiredJun 13, 05Aug 16, 11[C25F]
7875469 Method of operating and process for fabricating an electron sourceExpiredDec 12, 07Jan 25, 11[H01L]
2011/0014,858 GROOVED CMP POLISHING PADAbandonedJul 16, 10Jan 20, 11[B24D]
2010/0276,392 CMP SYSTEM UTILIZING HALOGEN ADDUCTAbandonedJul 19, 10Nov 04, 10[C23F]
2010/0190,339 COMPOSITIONS AND METHODS FOR CHEMICAL-MECHANICAL POLISHING OF PHASE CHANGE MATERIALSAbandonedJul 24, 08Jul 29, 10[C09K, H01L]
2010/0144,245 METHODS AND APPARATUS FOR CHEMICAL-MECHANICAL POLISHING UTILIZING LOW SUSPENDED SOLIDS POLISHING COMPOSITIONSAbandonedDec 07, 09Jun 10, 10[B24B]
2010/0087,845 METHODS FOR AMELIORATING TISSUE TRAUMA FROM SURGICAL INCISIONSAbandonedJan 22, 08Apr 08, 10[A61B]

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