C. UYEMURA & CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 2329
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1883
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 10146
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 454
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 342
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 384
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359
 
  
 
A45D HAIRDRESSING OR SHAVING EQUIPMENT; MANICURING OR OTHER COSMETIC TREATMENT 234
 
  
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 262
 
  
 
B25B TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING242

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0010,261 CLAMPER AND HOLDING JIG INCLUDING SAMESep 22, 17Jan 11, 18[C25D, B25B, D06F, B60R, A45D, H05K]
2017/0253,975 METHOD FOR MANUFACTURING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED THEREBYSep 14, 15Sep 07, 17[C23C]
2015/0267,310 TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAMEMar 18, 15Sep 24, 15[C25D, H05K]
2012/0279,869 CHROMIUM PLATING METHODDec 24, 10Nov 08, 12[C25D]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9822459 Clamper and holding jig including sameAug 07, 14Nov 21, 17[C25D, B25B, D06F, A45D, H05K]
9730337 Plating methodMay 22, 12Aug 08, 17[C23C, C25D, B05D, H05K]
9657406 Surface treating apparatus and plating tankJun 18, 12May 23, 17[C25D]
9567686 Aluminum oxide film remover and method for surface treatment of aluminum or aluminum alloyJun 23, 11Feb 14, 17[C23C, C25D, C23G]
9374913 Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameSep 05, 14Jun 21, 16[C23C, H05K]
9359676 Surface treating apparatusSep 26, 13Jun 07, 16[C23C, B05C, B05B, H05K]
9242281 Workpiece surface treatment systemApr 23, 14Jan 26, 16[C25D, B08B, B65G]
9139915 Solution for removing aluminum oxide film and method for surface treatment of aluminum or aluminum alloyJul 18, 11Sep 22, 15[C09K, C23C, C23G, B44C]
9120113 Surface treating apparatusJul 26, 13Sep 01, 15[B05C, B05B, B08B]
9045836 Electrolytic regeneration deviceAug 26, 11Jun 02, 15[C25B, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0042,754 METAL MEMBER FOR MAGNETIC STORAGE MEDIUM AND MAGNETIC STORAGE MEDIUMAbandonedJul 06, 15Feb 11, 16[G11B]
2015/0289,382 PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY SAID METHODAbandonedOct 29, 13Oct 08, 15[H05K]
2014/0339,463 DESMEAR SOLUTION AND DESMEAR METHODAbandonedSep 11, 12Nov 20, 14[C09K, H05K]
2014/0242,288 REDUCING ELECTROLESS SILVER PLATING SOLUTION AND REDUCING ELECTROLESS SILVER PLATING METHODAbandonedOct 09, 12Aug 28, 14[C23C]
2013/0341,199 ELECTRO COPPER PLATING ADDITIVE AND ELECTRO COPPER PLATING BATHAbandonedMar 23, 12Dec 26, 13[C25D]
2013/0295,294 ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHODAbandonedDec 28, 12Nov 07, 13[C23C]
2013/0056,362 MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARDAbandonedNov 01, 12Mar 07, 13[H05K]
2012/0167,916 NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHODAbandonedSep 24, 10Jul 05, 12[B08B, C11D]
2012/0058,276 SOLUTION FOR PROCESSING OF METAL REPLACEMENT WITH METAL ALUMINUM OR ALUMINUM ALLOY AND METHOD FOR SURFACE PROCESSING USING SUCH SOLUTIONAbandonedNov 15, 11Mar 08, 12[B05D]
2011/0259,373 METHOD AND AGENT FOR SURFACE PROCESSING OF PRINTED CIRCUIT BOARD SUBSTRATEAbandonedApr 19, 11Oct 27, 11[B08B]
2011/0214,994 PRETREATING AGENT FOR ELECTROPLATING, PRETREATMENT METHOD FOR ELECTROPLATING, AND ELECTROPLATING METHODAbandonedMar 01, 11Sep 08, 11[C09K, C25D]
2011/0146,732 Workpiece Surface Treatment SystemAbandonedMar 04, 11Jun 23, 11[B08B]
2011/0089,044 COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING METHODAbandonedOct 13, 10Apr 21, 11[C25D]
2011/0056,840 ELECTROLYTIC PLATING EQUIPMENT AND ELECTROLYTIC PLATING METHODAbandonedSep 07, 10Mar 10, 11[C25D]
2009/0133,782 Solution for processing of metal replacement with metal aluminum or aluminum alloy and method for surface processing using such solutionAbandonedNov 24, 08May 28, 09[C23C]
2009/0092,749 MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARDAbandonedSep 18, 08Apr 09, 09[B05D]
2008/0173,550 METHOD FOR FORMING A DISPLACEMENT TIN ALLOY PLATED FILM, DISPLACEMENT TIN ALLOY PLATING BATH AND METHOD FOR MAINTAINING A PLATING PERFORMANCEAbandonedJan 04, 08Jul 24, 08[C25D]
2008/0169,267 Solution for removing aluminum oxide film and method for surface treatment of aluminum or aluminum alloyAbandonedJan 10, 08Jul 17, 08[C09K, B05D, C23F]
2007/0221,506 ELECTROPLATING METHODAbandonedMar 07, 07Sep 27, 07[C25D]
2007/0108,044 Plating tankAbandonedNov 08, 06May 17, 07[C25D]

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