BONDTECH CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 8354
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 489
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS297
 
  
 
H05H PLASMA TECHNIQUE 228
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1127

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0047,225 SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHODApr 24, 15Feb 16, 17[H01J, H01L, H05H]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9870922 Substrate bonding apparatus and substrate bonding methodApr 24, 15Jan 16, 18[H01J, H01L, B23K, H05H]
9601350 Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblyJan 30, 12Mar 21, 17[H01J, H01L, B23K]
9379082 Pressure application apparatus and pressure application methodOct 27, 15Jun 28, 16[H01L, G01B, H05K]
9243894 Pressure application apparatus and pressure application methodMar 09, 10Jan 26, 16[H01L, G01B, H05K]
9142532 Chip-on-wafer bonding method and bonding device, and structure comprising chip and waferApr 24, 13Sep 22, 15[H01L, B23K]
7686912 Method for bonding substrates and method for irradiating particle beam to be utilized thereforAug 27, 04Mar 30, 10[B32B]
7550366 Method for bonding substrates and device for bonding substratesDec 02, 05Jun 23, 09[H01L]

Expired/Abandoned/Withdrawn Patents

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