BESI SWITZERLAND AG

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 9353
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 588
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 254
 
  
 
B25J MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES 256
 
  
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 163
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
B23Q DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING 139
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9889516 Device for dispensing and distributing flux-free solder on a substrateJul 03, 14Feb 13, 18[B23K]
9721819 Method for mounting semiconductors provided with bumps on substrate locations of a substrateAug 29, 16Aug 01, 17[H01L]
9666460 Through type furnace for substrates comprising a longitudinal slitNov 20, 14May 30, 17[H01L, B23K]
9364953 Kinematic holding system for a placement head of a placement apparatusJul 23, 13Jun 14, 16[B23P, B25J, H05K]
9339885 Method and apparatus for dispensing flux-free solder on a substrateJun 12, 13May 17, 16[H01L, B23K]
9240334 Method for detaching a semiconductor chip from a foilNov 20, 13Jan 19, 16[H01L, B32B]
9233389 Device for dispensing adhesive on a substrateApr 15, 14Jan 12, 16[B05C, H01L, B05B, H05K]
9039867 Method for detaching a semiconductor chip from a foilMar 15, 13May 26, 15[H01L, B32B]
8925608 Bonding head with a heatable and coolable suction memberJan 17, 14Jan 06, 15[H01L, B29C, B30B, B32B]
6818543 Process and apparatus for mounting semiconductor components to substrates and parts thereforJul 29, 02Nov 16, 04[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0256,949 Apparatus For Dispensing Flux-Free Solder On A SubstrateAbandonedMay 16, 16Sep 08, 16[B23K]
2014/0311,652 Method And Apparatus For Mounting Electronic Or Optical Components On A SubstrateAbandonedApr 18, 14Oct 23, 14[H01L]
2014/0175,159 Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A SubstrateAbandonedDec 20, 13Jun 26, 14[H01L]
7764366 Robotic die sorter with optical inspection systemExpiredJul 11, 06Jul 27, 10[G01N]

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