Azurewave Technologies, Inc.

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Patent Activity in the Last 10 Years

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Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 11351
 
  
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 4238
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2157
 
  
 
H04B TRANSMISSION 2208
 
  
 
H04W WIRELESS COMMUNICATION NETWORKS 2186
 
  
 
A47G HOUSEHOLD OR TABLE EQUIPMENT 126
 
  
 
F16M FRAMES, CASINGS, OR BEDS, OF ENGINES OR OTHER MACHINES OR APPARATUS, NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS OR SUPPORTS134
 
  
 
F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR 1109
 
  
 
G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR 159

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9485671 Inter-stage test structure for wireless communication apparatusFeb 27, 14Nov 01, 16[H04W, G01R]
9373556 Module IC package structure and method for manufacturing the sameNov 14, 13Jun 21, 16[H01L, H05K]
9349903 Image sensing module and method of manufacturing the sameOct 17, 13May 24, 16[H01L, H04N]
9287306 Production apparatus for manufacturing sensor package structureAug 22, 13Mar 15, 16[H01L]
9076801 Module IC package structureNov 13, 13Jul 07, 15[H01L]
9031398 Wireless camera apparatus and wireless camera deviceAug 15, 13May 12, 15[H04N, G03B]
9031808 System of testing multiple RF modules and method thereofMar 17, 12May 12, 15[G01R]
9007419 Audiovisual apparatus for reducing echoJan 11, 13Apr 14, 15[H04M, H04N, G09G]
8944634 Bulb type apparatus and bulb socketJul 26, 13Feb 03, 15[F21V]
8876070 Thin-type collapsible foot standJun 09, 12Nov 04, 14[F16M, A47G]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0130,033 MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELDING FUNCTION AND METHOD FOR MANUFACTURING THE SAMEAbandonedNov 10, 13May 14, 15[H01L]
2014/0176,433 INTERACTIVE PROJECTION SYSTEM, PROJECTOR THEREOF, AND CONTROL METHOD THEREOFAbandonedMar 16, 13Jun 26, 14[G06F]
2014/0139,808 PROJECTION DEVICE FOR INCREASING LIGHT-TRANSMITTING EFFICIENCYAbandonedJan 14, 13May 22, 14[G03B]
8593560 Image-capturing module for simplifying optical componentExpiredJan 13, 10Nov 26, 13[H04N, G05B, G06K]
2013/0307,105 IMAGE-SENSING MODULE FOR REDUCING ITS WHOLE THICKNESSAbandonedJun 23, 12Nov 21, 13[H01L]
2013/0234,272 IMAGE-SENSING MODULEAbandonedApr 20, 12Sep 12, 13[H01L]
2013/0234,534 POWER SOCKET WITH WIRELESS COMMUNICATION CAPABILITY, SYSTEM HAVING THE SAME AND METHOD THEREOFAbandonedMar 12, 12Sep 12, 13[H02B]
8519428 Vertical stacked light emitting structureExpiredSep 02, 11Aug 27, 13[H01L]
8476651 Vertical stacked light emitting structureExpiredSep 02, 11Jul 02, 13[H01L]
2013/0161,491 OPTICAL TOUCH CONTROL MODULEAbandonedJan 19, 12Jun 27, 13[G01J]
2013/0162,597 OPTICAL TOUCH CONTROL MODULEAbandonedJan 19, 12Jun 27, 13[G06F]
2013/0113,089 MODULE IC PACKAGE STRUCTURE HAVING A METAL SHIELDING FUNCTION FOR PREVENTING ELECTRICAL MALFUNCTION INDUCED BY SHORT-CIRCUITAbandonedDec 15, 11May 09, 13[H01L]
8368003 Image-capturing module for simplifying optical component and reducing assembly timeExpiredApr 19, 10Feb 05, 13[H01L]
8320960 Docking station and computer system using the docking stationExpiredJul 21, 09Nov 27, 12[H04B]
8274594 Image-capturing module for simplifying optical componentExpiredJan 13, 10Sep 25, 12[G08B, H04N, H04Q, G08C, G05B, G06F, G06K]
2012/0211,876 MODULE IC PACKAGE STRUCTUREAbandonedApr 23, 11Aug 23, 12[H01L]
8242381 Chip-level through hole structure of electronic packageExpiredSep 17, 07Aug 14, 12[H05K]
2012/0162,930 MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELD FUNCTION AND METHOD FOR MAKING THE SAMEAbandonedDec 23, 10Jun 28, 12[H05K]
2012/0139,089 MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAMEAbandonedJan 12, 11Jun 07, 12[H01L]
2011/0304,379 SIGNAL MATCHING MODULE WITH COMBINATION OF ELECTRONIC COMPONENTS FOR SIGNAL MATCHING OF SINGLE OR MULTIPLE SUBSYSTEMSAbandonedAug 25, 11Dec 15, 11[H03K]

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