Admap Inc.

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Patent Activity in the Last 10 Years

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Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8507922 Silicon carbide substrate, semiconductor device, and SOI waferJul 05, 11Aug 13, 13[H01L]
8291581 Method for production of substrate electrode for plasma processingMay 30, 08Oct 23, 12[H01R]
7087980 Film thickness measuring monitor waferMar 04, 02Aug 08, 06[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0157,067 PLASMA-RESISTANT MEMBER AND METHOD FOR REGENERATING SAMEAbandonedJun 30, 11Jun 20, 13[C04B]
2006/0234,058 Silicon carbide product, method for producing same, and method for cleaning silicon carbide productAbandonedJul 07, 04Oct 19, 06[C03C, C23G]

Top Inventors for This Owner

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