Accretech USA, Inc.
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- May 14, 2009 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 443 Total Citation Count
- Nov 04, 1985 Earliest Filing
- 26 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
- No Technology to Display
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
- No Recent Patents to Display
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2009/0122,304 Apparatus and Method for Wafer Edge Exclusion MeasurementAbandonedAug 08, 08May 14, 09[H05B, G01N]
2009/0116,727 Apparatus and Method for Wafer Edge Defects DetectionAbandonedAug 08, 08May 07, 09[G06K]
2008/0017,316 Clean ignition system for wafer substrate processingAbandonedJul 06, 07Jan 24, 08[F23Q, C23F]
2008/0010,845 Apparatus for cleaning a wafer substrateAbandonedJul 06, 07Jan 17, 08[H01L, G06F, G01C, G01D]
2008/0011,332 Method and apparatus for cleaning a wafer substrateAbandonedJul 06, 07Jan 17, 08[B08B]
2007/0062,647 Method and apparatus for isolative substrate edge area processingAbandonedSep 19, 05Mar 22, 07[H01L, C23F]
2007/0066,076 Substrate processing method and apparatus using a combustion flameAbandonedSep 19, 05Mar 22, 07[H01L]
2005/0205,518 Method for shaping thin films in the near-edge regions of in-process semiconductor substratesAbandonedMay 18, 05Sep 22, 05[H01L, B44C]
6936546 Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substratesExpiredMar 27, 03Aug 30, 05[H01L]
6641464 Method and apparatus for polishing the edge of a bonded waferExpiredFeb 21, 03Nov 04, 03[B24B]
6494775 Wafer carrier having more support ribs and lighter weight and methodExpiredOct 15, 01Dec 17, 02[B24B]
6306016 Wafer notch polishing machine and method of polishing an orientation notch in a waferExpiredAug 03, 00Oct 23, 01[B24B]
6290274 Vacuum system and method for securing a semiconductor wafer in a planar positionExpiredApr 09, 99Sep 18, 01[B25B, B66C]
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