ATOTECH DEUTSCHLAND GMBH

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1083
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 8032
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 32330
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 31125
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 2760
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 1620
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM7150
 
  
 
C25B ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR 629
 
  
 
B01D SEPARATION 5129
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR590

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0335,462 PLATING BATH AND METHOD FOR ELECTROLESS DEPOSITION OF NICKEL LAYERSNov 17, 15Nov 23, 17[C23C]
2017/0335,485 METHOD AND APPARATUS FOR ELECTROLYTICALLY DEPOSITING A DEPOSITION METAL ON A WORKPIECEAug 07, 17Nov 23, 17[C25D, H05K]
2017/0327,954 PLATING BATH COMPOSITIONS FOR ELECTROLESS PLATING OF METALS AND METAL ALLOYSDec 04, 15Nov 16, 17[C23C]
2017/0321,327 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUMDec 17, 15Nov 09, 17[C23C]
2017/0292,191 PROCESS FOR METALLIZING PLASTIC PARTSOct 13, 15Oct 12, 17[C23C, C25D, B29C]
2017/0275,767 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYSOct 30, 15Sep 28, 17[C23C, C23G, C23F, H05K]
2017/0275,774 ACIDIC ZINC AND ZINC NICKEL ALLOY PLATING BATH COMPOSITION AND ELECTROPLATING METHODOct 19, 15Sep 28, 17[C25D]
2017/0029,971 Process to deposit zinc-iron alloy layer materialOct 11, 16Feb 02, 17[C25D]
2016/0237,571 NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACESSep 22, 14Aug 18, 16[C23C, C25D, C03C, H01L, C04B]
2016/0222,519 METHOD OF SELECTIVELY TREATING COPPER IN THE PRESENCE OF FURTHER METALOct 14, 14Aug 04, 16[C23C, C23F]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9920432 Adhesion promoting agents for metallization of substrate surfacesDec 05, 12Mar 20, 18[C23C, C25D, B05D, B82Y, H05K]
9909216 Plating bath compositions for electroless plating of metals and metal alloysDec 04, 15Mar 06, 18[C23C]
9896765 Pre-treatment process for electroless platingJan 14, 15Feb 20, 18[C23C, B05D, C23F, H05K]
9822034 Method for electroless platingApr 17, 12Nov 21, 17[C23C, C03C, B05D]
9790607 3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating bathsAug 02, 17Oct 17, 17[C25D, C07D]
9783891 Iron boron alloy coatings and a process for their preparationMar 17, 15Oct 10, 17[C23C]
9758874 Plating bath composition and method for electroless plating of palladiumApr 07, 15Sep 12, 17[C23C, H01L, H05K]
9763336 Methods of treating metal surfaces and devices formed therebyJul 06, 10Sep 12, 17[C23C, C08J, C09J, H05K]
9752244 Galvanic nickel electroplating bath for depositing a semi-bright nickelMar 20, 14Sep 05, 17[C25D]
9745665 Method and apparatus for electrolytically depositing a deposition metal on a workpieceApr 16, 13Aug 29, 17[C25D, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0159,195 COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERSAbandonedAug 21, 15Jun 08, 17[C25D]
2016/0273,112 ELECTROLESS COPPER PLATING SOLUTIONAbandonedMar 25, 14Sep 22, 16[C23C]
2016/0060,781 METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALSAbandonedMay 09, 14Mar 03, 16[C25D, H05K]
2016/0024,674 FUNCTIONAL CHROMIUM LAYER WITH IMPROVED CORROSION RESISTANCEAbandonedJan 22, 14Jan 28, 16[C25D]
2016/0024,683 APPARATUS AND METHOD FOR ELECTROLYTIC DEPOSITION OF METAL LAYERS ON WORKPIECESAbandonedMar 20, 14Jan 28, 16[C25D]
2015/0307,992 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACESAbandonedDec 06, 13Oct 29, 15[C23C, C25D]
2015/0289,387 METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLINGAbandonedNov 27, 12Oct 08, 15[C25D, H05K]
2015/0166,802 COMPOSITION FOR FORMING A SEED LAYERAbandonedJul 12, 13Jun 18, 15[C25D, C09D, C08K]
2015/0129,540 PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACESAbandonedJun 05, 13May 14, 15[C23C]
2015/0050,422 METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERSAbandonedMar 21, 13Feb 19, 15[C23C, C25D]
2015/0014,177 METHOD FOR PRODUCING MATT COPPER DEPOSITSAbandonedNov 27, 12Jan 15, 15[C25D]
2014/0262,805 AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYSAbandonedNov 08, 12Sep 18, 14[C25D, C23F]
2014/0251,502 Methods of Treating Metal Surfaces and Devices Formed TherebyAbandonedMay 16, 14Sep 11, 14[C23C]
2014/0242,264 FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTIONAbandonedOct 01, 12Aug 28, 14[C23C]
2014/0150,689 ELECTROLESS NICKEL PLATING BATH COMPOSITIONAbandonedJul 04, 12Jun 05, 14[C23C]
2014/0141,169 METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACEAbandonedJun 29, 12May 22, 14[B05D]
2014/0138,252 Aqueous Acidic Bath for Electrolytic Deposition of CopperAbandonedApr 25, 12May 22, 14[C25D]
2014/0116,950 Device and Method for Recovering a Recovering Material from a Recovering Fluid Containing the Recovering MaterialAbandonedMay 24, 12May 01, 14[B01D]
2013/0316,190 ZINC-IRON ALLOY LAYER MATERIALAbandonedJan 30, 12Nov 28, 13[C25D, B32B]
2013/0199,825 COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRYAbandonedOct 21, 11Aug 08, 13[H05K]

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