ASM NUTOOL, INC.
Patent Owner
Stats
- 4 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Dec 13, 2011 most recent publication
Details
- 4 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 819 Total Citation Count
- Jan 11, 2002 Earliest Filing
- 21 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
7625814 Filling deep features with conductors in semiconductor manufacturingApr 30, 07Dec 01, 09[H01L]
7485561 Filling deep features with conductors in semiconductor manufacturingMar 29, 06Feb 03, 09[H01L]
7070564 Devices for physiological fluid sampling and methods of using the sameNov 22, 04Jul 04, 06[A61B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2009/0065,365 METHOD AND APPARATUS FOR COPPER ELECTROPLATINGAbandonedSep 11, 07Mar 12, 09[C23C, C25D]
2008/0237,048 METHOD AND APPARATUS FOR SELECTIVE ELECTROFILLING OF THROUGH-WAFER VIASAbandonedMar 30, 07Oct 02, 08[C25D]
2008/0242,078 PROCESS OF FILLING DEEP VIAS FOR 3-D INTEGRATION OF SUBSTRATESAbandonedMar 30, 07Oct 02, 08[H01L]
2006/0252,254 Filling deep and wide openings with defect-free conductorAbandonedFeb 09, 06Nov 09, 06[H01L]
2006/0035,569 Integrated system for processing semiconductor wafersAbandonedOct 11, 05Feb 16, 06[B24B]
2005/0159,084 Chemical mechanical polishing method and apparatus for controlling material removal profileAbandonedJan 21, 04Jul 21, 05[B24B]
2005/0118,932 Adjustable gap chemical mechanical polishing method and apparatusAbandonedJul 06, 04Jun 02, 05[B24B]
2005/0095,846 System and method for defect free conductor deposition on substratesAbandonedNov 01, 04May 05, 05[H01L]
2005/0042,873 Method and system to provide electroplanarization of a workpiece with a conducting material layerAbandonedAug 23, 04Feb 24, 05[H01L]
2004/0132,295 Method and device to remove unwanted material from the edge region of a workpieceAbandonedOct 31, 03Jul 08, 04[H01L]
2004/0102,049 Method and system to provide material removal and planarization employing a reactive padAbandonedNov 18, 03May 27, 04[H01L]
2004/0089,421 Distributed control system for semiconductor manufacturing equipmentAbandonedOct 31, 03May 13, 04[H01L]
2004/0035,709 Methods for repairing defects on a semiconductor substrateAbandonedApr 29, 03Feb 26, 04[C25D]
2004/0023,607 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layersAbandonedMar 13, 03Feb 05, 04[B24B]
2003/0213,558 Chemical mechanical polishing endpoint detectionAbandonedJun 10, 03Nov 20, 03[H01L, C23F]
2003/0146,089 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influenceAbandonedFeb 04, 03Aug 07, 03[C25D]
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