ASIA IC MIC-PROCESS, INC.
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Dec 14, 2017 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 39 Total Citation Count
- Apr 14, 1997 Earliest Filing
- 7 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
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Recent Publications
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Recent Patents
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Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2006/0196,283 Measurement of Thickness Profile and Elastic Modulus Profile of a Polishing PadAbandonedJan 10, 06Sep 07, 06[B24B, G01N]
2003/0062,346 Method of vacuum holes formation on carrier film of chemical mechanical polishing machineAbandonedSep 28, 01Apr 03, 03[B23K]
6524523 Method for forming dresser of chemical mechanical polishing padExpiredSep 28, 01Feb 25, 03[B22F]
5868609 Wafer carrier rotating head assembly for chemical-mechanical polishing apparatusExpiredApr 14, 97Feb 09, 99[B24B]
5843269 Slurry dispensing system for chemical-mechanical polishing apparatusExpiredApr 18, 97Dec 01, 98[B44C]
5830043 Chemical-mechanical polishing apparatus with in-situ pad conditionerExpiredApr 14, 97Nov 03, 98[B24B]
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