APIC YAMADA CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2798
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 9353
 
  
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 262
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 2196
 
  
 
B21J FORGING; HAMMERING; PRESSING; RIVETING; FORGE FURNACES 119
 
  
 
B28B SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER 127
 
  
 
B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES 125
 
  
 
B30B PRESSES IN GENERAL; PRESSES NOT OTHERWISE PROVIDED FOR 121
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
H01Q AERIALS 1109

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0050,345 RESIN MOLDING METHOD AND RESIN MOLDING DIE SETFeb 27, 15Feb 23, 17[H01L, B29C, H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9831187 Apparatus and method for electrostatic spraying or electrostatic coating of a thin filmNov 11, 13Nov 28, 17[H01L, B29C, B05B, H05K]
9738014 Resin molding machineNov 23, 11Aug 22, 17[H01L, B29C]
9589907 Apparatus and method for electrostatic spraying or electrostatic coating of a thin filmNov 11, 13Mar 07, 17[H01L, B29C, B05B, H05K]
9238314 Method for resin molding and resin molding apparatusNov 29, 12Jan 19, 16[H01L, B29C]
9129203 RFID tag, method for producing RFID tag, and moldSep 06, 12Sep 08, 15[B29C, H01Q, G06K]
9016342 Bonding apparatus and bonding methodJul 15, 11Apr 28, 15[H01L, B32B]
8967484 RFID tag, wireless charging antenna part, method of manufacturing the same, and moldMay 27, 11Mar 03, 15[H01L, B29C, B29L, G06K]
8727757 Molding die set and resin molding apparatus having the sameJan 30, 12May 20, 14[H01L, B29C]
7909596 Resin molding machine and method of resin moldingNov 20, 07Mar 22, 11[B28B, B08B]
7407608 Resin molding equipment and resin molding methodNov 01, 05Aug 05, 08[B29C]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0077,042 APPARATUS AND METHOD FOR ELECTROSTATIC SPRAYING OR ELECTROSTATIC COATING OF A THIN FILMAbandonedNov 28, 16Mar 16, 17[H01L]
2012/0175,812 METHOD OF RESIN MOLDING, RESIN MOLDING APPARATUS AND FEEDING HANDLERAbandonedJan 10, 12Jul 12, 12[H01L, B29C]
2007/0284,345 SEMICONDUCTOR CUTTING DEVICE, SEMICONDUCTOR CUTTING METHOD, SEMICONDUCTOR CUTTING SYSTEM, LASER CUTTING DEVICE AND LASER CUTTING METHODAbandonedJun 06, 07Dec 13, 07[B23K]
2007/0262,049 Imprinting method and nano-imprinting apparatusAbandonedMay 14, 07Nov 15, 07[B29C, B44C]
7175405 Compression molding machineExpiredNov 27, 02Feb 13, 07[B29C]
6459159 Apparatus for sealing a semiconductor device utilizing a release filmExpiredAug 30, 00Oct 01, 02[H01L]
2002/0017,738 Resin sealing method and resin sealing apparatusAbandonedJun 20, 01Feb 14, 02[H01L, B29C]
5770128 Method of transfer molding and a transfer molding machineExpiredDec 08, 93Jun 23, 98[B29C]
5636430 General-purpose lead working machineExpiredNov 30, 94Jun 10, 97[H01L, B23P]
5575610 Transport-by-suction type dieExpiredNov 30, 94Nov 19, 96[B21J]
5507910 Lead frame taping machineExpiredApr 12, 94Apr 16, 96[B32B]

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