APACK TECHNOLOGIES INC.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2003/0071,354 Wafer level chip scale package and method of fabricating the sameAbandonedDec 12, 01Apr 17, 03[H01L]
2002/0137,304 Method of reworking bumpAbandonedMay 11, 01Sep 26, 02[H01L]
2002/0137,325 Method for forming bumpsAbandonedMay 11, 01Sep 26, 02[H01L]
6443059 Solder screen printing processExpiredMar 07, 01Sep 03, 02[B41M]
2002/0086,512 Method of forming solder bumpsAbandonedJan 17, 01Jul 04, 02[H01L]
6387795 Wafer-level packagingExpiredMay 11, 01May 14, 02[H01L]
6376354 Wafer-level packaging processExpiredMay 11, 01Apr 23, 02[H01L]
6307256 Semiconductor package with a stacked chip on a leadframeExpiredOct 26, 98Oct 23, 01[H01L]
6258622 Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging methodExpiredJun 07, 99Jul 10, 01[H01L]
6259266 Testing device and method for known good chipExpiredOct 27, 98Jul 10, 01[G01R]
6221689 Method for improving the reliability of underfill process for a chipExpiredOct 24, 97Apr 24, 01[H01L]

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