ALPHA METALS, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1875
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 17345
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 978
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 8148
 
  
 
C22C ALLOYS 765
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 646
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6151
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 389
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 348
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 371

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0020,554 Solder Preforms and Solder Alloy Assembly MethodsSep 27, 17Jan 18, 18[B23K, H05K]
2017/0113,306 Multilayered Metal Nano and Micron ParticlesJun 22, 15Apr 27, 17[B23K, B22F]
2016/0214,213 HIGH IMPACT SOLDER TOUGHNESS ALLOYDec 28, 15Jul 28, 16[B23K, C22C]
2016/0107,267 SOLDER ALLOYDec 22, 15Apr 21, 16[B23K, C22C]
2016/0023,309 LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURESOct 08, 15Jan 28, 16[B23K, H05K, C22C]
2014/0328,039 SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINTSep 25, 12Nov 06, 14[H01L, H05K]
2014/0153,203 METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODSSep 16, 13Jun 05, 14[H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9566668 Flux formulationsNov 12, 13Feb 14, 17[B23K, C08K, H05K]
9362424 Electrical contactsMar 20, 08Jun 07, 16[H01L, H05K]
9221131 Solder alloyDec 01, 05Dec 29, 15[B23K, C22C]
9217088 Particles and inks and films using themJun 24, 11Dec 22, 15[C23C, H01L, B82Y, C09D, H01B, B22F, H05K, C08K]
RE45279 Process for silver plating in printed circuit board manufactureMay 14, 12Dec 09, 14[C25D]
RE45175 Process for silver plating in printed circuit board manufactureOct 18, 12Oct 07, 14[C23C, H05K]
8641964 Solder alloyFeb 25, 08Feb 04, 14[C22C]
8597548 Solvent systems for metals and inksSep 19, 07Dec 03, 13[B05D, H01B, G01D]
8564140 Mono-acid hybrid conductive composition and methodSep 25, 09Oct 22, 13[H01L]
8555491 Methods of attaching a die to a substrateJul 17, 08Oct 15, 13[H05K]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0144,462 HIGH IMPACT SOLDER TOUGHNESS ALLOYAbandonedDec 28, 15May 26, 16[B23K, C22C]
2015/0266,137 LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURESAbandonedOct 09, 13Sep 24, 15[B23K, C22C]
2014/0219,711 HIGH IMPACT TOUGHNESS SOLDER ALLOYAbandonedAug 02, 12Aug 07, 14[B23K]
2014/0199,115 SOLDER COMPOSITIONSAbandonedAug 02, 12Jul 17, 14[B23K]
2014/0186,524 SOLVENT SYSTEMS FOR METALS AND INKSAbandonedDec 03, 13Jul 03, 14[C09D]
2010/0139,952 FLUX FORMULATIONSAbandonedJul 02, 09Jun 10, 10[B23K, H01B, H05K, B32B]
6440647 Resist stripping processExpiredOct 03, 00Aug 27, 02[G03F]
6158339 Stencil holder assembly for use with solder paste stencil printersExpiredJan 29, 99Dec 12, 00[B41F]
6017983 Color indicator for completion of polymerization for thermosetsExpiredJan 29, 98Jan 25, 00[B41M, C08L]

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