ALPHA ASSEMBLY SOLUTIONS INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1083
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 8148
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 349
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 2100
 
  
 
C22C ALLOYS 270
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
C01B NON-METALLIC ELEMENTS; COMPOUNDS THEREOF178
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 1115
 
  
 
C22B PRODUCTION OR REFINING OF METALS 127

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0072,573 Production of GrapheneSep 14, 16Mar 15, 18[C01B, C25B]
2018/0056,455 Engineered Polymer-Based Electronic MaterialsMar 31, 16Mar 01, 18[H01L, B23K, C08K]
2017/0245,404 RF SHIELD WITH SELECTIVELY INTEGRATED SOLDERFeb 07, 17Aug 24, 17[B23K, H05K]
2017/0200,527 Stretchable Interconnects for Flexible Electronic SurfacesJul 14, 15Jul 13, 17[B23K, H01B, B22F, H05K]
2017/0144,221 Sintering Materials and Attachment Methods Using SameJun 12, 15May 25, 17[H01L, B23K, B22F]
2017/0135,227 Engineered Residue Solder Paste TechnologyJun 19, 15May 11, 17[H01L, B23K, H05K]
2016/0271,738 Lead-Free, Silver-Free Solder AlloysOct 29, 14Sep 22, 16[B23K, C22C]
2016/0207,286 COMPOSITE AND MULTILAYERED SILVER FILMS FOR JOINING ELECTRICAL AND MECHANICAL COMPONENTSAug 29, 14Jul 21, 16[B22F, B32B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9802275 Rosin-free thermosetting flux formulationsDec 31, 14Oct 31, 17[B23K, H05K]
9801285 Solder preforms and solder alloy assembly methodsMar 15, 13Oct 24, 17[B23K, H05K]
9786629 Dual-side reinforcement flux for encapsulationJul 31, 14Oct 10, 17[H01L, H05K]
9751159 Flux formulationsDec 27, 16Sep 05, 17[B23K, C08L, C08K, H05K]
9615463 Method for producing a high-aspect ratio conductive pattern on a substrateSep 19, 07Apr 04, 17[H05K]

Expired/Abandoned/Withdrawn Patents

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