ADVANPACK SOLUTIONS PTE LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 12350
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9379044 Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereofOct 20, 12Jun 28, 16[H01L]
9362206 Chip and manufacturing method thereofJun 23, 14Jun 07, 16[H01L]
9082775 System for encapsulation of semiconductor diesNov 17, 09Jul 14, 15[H01L]
9059050 Manufacturing methods of semiconductor substrate, package and deviceJan 21, 14Jun 16, 15[H01L]
8917521 Etch-back type semiconductor package, substrate and manufacturing method thereofApr 28, 11Dec 23, 14[H01L, H05K]
8846519 Interconnections for fine pitch semiconductor devices and manufacturing method thereofMay 09, 12Sep 30, 14[H01L]
8796844 Package structureSep 02, 09Aug 05, 14[H01L, H05K]
8766438 Package structureSep 01, 09Jul 01, 14[H01L]
8709874 Manufacturing method for semiconductor device carrier and semiconductor package using the sameAug 31, 11Apr 29, 14[H01L]
7456496 Package design and method of manufacture for chip grid arrayMay 12, 05Nov 25, 08[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8664750 Semiconductor substrate, package and deviceExpiredNov 17, 09Mar 04, 14[H01L]
2004/0198,022 Method for forming a wafer level chip scale package, and package formed therebyAbandonedApr 16, 04Oct 07, 04[H01L]

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