ADVANPACK SOLUTIONS PTE LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 27335
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 687
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 1115
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0330,842 Semiconductor Assembly and Method of Fabricating a Semiconductor StructureJul 20, 17Nov 16, 17[H01L]
2016/0329,306 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFJul 18, 16Nov 10, 16[H01L]
2015/0287,673 SEMICONDUCTOR PACKAGEJun 05, 15Oct 08, 15[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9892916 Manufacturing method of package substrate and package manufacturing method of semiconductor deviceJun 15, 16Feb 13, 18[H01L]
9847268 Semiconductor package and manufacturing method thereofNov 20, 09Dec 19, 17[H01L]
9754899 Semiconductor structure and method of fabricating the sameFeb 21, 14Sep 05, 17[H01L]
9723717 Substrate structure, semiconductor package device, and manufacturing method of semiconductor packageDec 19, 12Aug 01, 17[H01L, H05K]
9653323 Manufacturing method of substrate structure having embedded interconnection layersMar 04, 16May 16, 17[C25D, H01L, H05K]
9583449 Semiconductor packageDec 07, 15Feb 28, 17[H01L]
9396982 Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereofNov 26, 08Jul 19, 16[H01L]
9305868 Manufacturing method of forming an etch-back type semiconductor package with locking anchoragesDec 22, 14Apr 05, 16[H01L, H05K]
9301391 Substrate structure, semiconductor package device, and manufacturing method of substrate structureNov 29, 12Mar 29, 16[H01L, H05K]
9287157 Semiconductor element for package miniaturizationJun 29, 10Mar 15, 16[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0268,225 CHIP AND MANUFACTURING METHOD THEREOFAbandonedMay 18, 16Sep 15, 16[H01L]
2011/0049,708 Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the SameAbandonedAug 27, 10Mar 03, 11[H01L]
2008/0248,610 THERMAL BONDING PROCESS FOR CHIP PACKAGINGAbandonedApr 03, 07Oct 09, 08[H01L]
2008/0150,561 Device and method for testing semiconductor element, and manufacturing method thereofAbandonedDec 26, 07Jun 26, 08[G01R, H05K]
2007/0284,420 INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATEAbandonedJun 13, 06Dec 13, 07[B23K]
2007/0196,979 Flip chip in package using flexible and removable leadframeAbandonedFeb 21, 06Aug 23, 07[H01L]
2006/0180,888 Optical sensor package and method of manufactureAbandonedFeb 14, 05Aug 17, 06[H01L]
2006/0103,016 Heat sinking structureAbandonedNov 12, 04May 18, 06[H01L]
2006/0097,346 Structure for high quality factor inductor operationAbandonedNov 10, 04May 11, 06[H01L]
2006/0060,937 Embedded passive componentAbandonedSep 23, 04Mar 23, 06[H01L]
2005/0167,797 Structure packageAbandonedJan 29, 04Aug 04, 05[H01L]
2005/0133,933 Various structure/height bumps for wafer level-chip scale packageAbandonedDec 19, 03Jun 23, 05[H01L]
2005/0087,883 Flip chip package using no-flow underfill and method of fabricationAbandonedOct 22, 03Apr 28, 05[H01L]
2004/0130,034 Method for forming a wafer level chip scale packageAbandonedJun 13, 02Jul 08, 04[H01L]
2004/0108,580 Leadless semiconductor packaging structure with inverted flip chip and methods of manufactureAbandonedDec 09, 02Jun 10, 04[H01L]
2004/0084,508 Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assemblyAbandonedOct 30, 02May 06, 04[B23K]

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