ADVANCED SEMICONDUCTOR ENGINEERING, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 78860
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7187
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1875
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 18141
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11122
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 10115
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 814
 
  
 
H03F AMPLIFIERS 875
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 6199
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 678

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0076,118 SEMICONDUCTOR DEVICE PACKAGEAug 25, 17Mar 15, 18[H01L]
2018/0066,982 OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAMEAug 25, 17Mar 08, 18[G01J]
2018/0061,805 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAMEAug 22, 17Mar 01, 18[H01L]
2018/0017,741 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAMEJul 06, 17Jan 18, 18[H01L, B29C, G02B, H01S]
2018/0019,175 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAMEJul 13, 17Jan 18, 18[H01L]
2017/0365,543 SEMICONDUCTOR DEVICE PACKAGEJun 13, 17Dec 21, 17[H01L]
2017/0336,561 SEMICONDUCTOR DEVICE PACKAGESJan 13, 17Nov 23, 17[H01L, G02B]
2017/0294,560 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAMEMar 22, 17Oct 12, 17[H01L]
2017/0287,863 SEMICONDUCTOR DIE, SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING THE SAMEJun 20, 17Oct 05, 17[H01L]
2017/0287,871 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEMar 29, 16Oct 05, 17[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922917 Semiconductor package including substrates spaced by at least one electrical connecting elementAug 29, 16Mar 20, 18[H01L]
9922938 Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the sameSep 06, 16Mar 20, 18[H02J, H01L]
9917043 Semiconductor package device and method of manufacturing the sameApr 04, 17Mar 13, 18[H01L]
9917071 Semiconductor packagesDec 07, 16Mar 13, 18[H01L]
9911702 Semiconductor package structure and fabrication method thereofMay 02, 14Mar 06, 18[H01L]
9911709 Semiconductor device and semiconductor manufacturing processOct 26, 16Mar 06, 18[H01L]
9911877 Electronic device, package structure and method of manufacturing the sameNov 09, 16Mar 06, 18[F21V, H01L, G01J]
9905722 Optical device, optical module structure and manufacturing processDec 27, 16Feb 27, 18[H01L]
9891048 Measurement equipmentJan 29, 14Feb 13, 18[G01C, G01B]
9887167 Embedded component package structure and method of manufacturing the sameSep 19, 16Feb 06, 18[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2018/0052,281 SUBSTRATE, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTUREAbandonedAug 16, 16Feb 22, 18[H04B, G02B]
2014/0312,496 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICEAbandonedApr 30, 14Oct 23, 14[H01L]
2014/0252,547 SEMICONDUCTOR DEVICE HAVING INTEGRATED PASSIVE DEVICE AND PROCESS FOR MANUFACTURING THE SAMEAbandonedMar 08, 13Sep 11, 14[H01L]
2014/0198,459 STACKED PACKAGE DEVICE AND MANUFACTURING METHOD THEREOFAbandonedApr 22, 13Jul 17, 14[H01L]
2014/0001,621 SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND RELATED METHODSAbandonedAug 26, 13Jan 02, 14[H01L]
2013/0249,387 LIGHT-EMITTING DIODES, PACKAGES, AND METHODS OF MAKINGAbandonedMar 20, 12Sep 26, 13[H01J]
2013/0175,324 THERMAL COMPRESSION HEAD FOR FLIP CHIP BONDINGAbandonedJan 11, 12Jul 11, 13[B23K]
2013/0161,670 LIGHT EMITTING DIODE PACKAGES AND METHODS OF MAKINGAbandonedDec 23, 11Jun 27, 13[H01L]
2013/0161,816 SEMICONDUCTOR PACKAGEAbandonedFeb 22, 13Jun 27, 13[H01L]
2013/0134,600 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEAbandonedNov 28, 11May 30, 13[H01L]
2013/0122,216 STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING THE SAMEAbandonedJan 04, 13May 16, 13[H05K]
2013/0102,122 SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAMEAbandonedDec 12, 12Apr 25, 13[H01L]
2013/0068,517 SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEAbandonedNov 09, 12Mar 21, 13[H05K]
2013/0037,929 STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODSAbandonedAug 09, 11Feb 14, 13[H01L]
2013/0032,889 Silicon Chip Having Through Via and Method for Making the SameAbandonedAug 08, 12Feb 07, 13[H01L]
2012/0261,689 SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODSAbandonedApr 13, 11Oct 18, 12[H01L]
2012/0205,800 PACKAGING STRUCTUREAbandonedApr 17, 12Aug 16, 12[H01L]
2012/0119,342 ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedNov 11, 10May 17, 12[H01L]
2012/0104,634 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOFAbandonedJan 09, 12May 03, 12[H01L]
2012/0091,575 Semiconductor Package And Method For Making The SameAbandonedOct 15, 10Apr 19, 12[H01L]

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